Electronic Packaging Design and Validation
Our expertise goes to the next level, with expertise in the development of interconnect platforms and system integration, including high-speed interfaces.
Signal and Power Integrity
Our team’s expertise spans over 15 years experience dealing with signal integrity and power integrity challenges. From crosstalk mitigation, impedance matching, and trace-via design to complex S-parameter models and co-design with the power distribution network to match the most stringent specifications.
PCB and Package Design and Analysis
Our team is proficient with a wide variety of EDA design and simulation tools: Cadence Allegro SPB and APM, Altium Designer, and signal/power integrity tools such as Sigrity, Hypherlinx, Ansys HFSS/SiWave, Keysight ADS…
High-frequency modeling, characterization and measurement of interconnect systems
We cover also the model-to-hardware correlation aspects with plenty of experience on high-frequency measurement and characterization techniques: connectorized and probe-based assemblies, calibration and deembedding techniques, spectrum and vector network analysis, time domain reflectometry, high-speed jitter and BER analysis.
Sample project
- IC I/O and package specifications, per pin and interface, PDN requirements.
- PCB and/or Package Design, with build of materials, prefabrication verifications, and performance simulations.
- Follow-up and assistance with fabrication services.
- Post-fabrication validation and characterization, testbed design, test plan proposal and execution, and model-to-hardware correlation studies.